Through-Silicon Vias for 3D Integration

Seeing What's Next: Using the Theories of Innovation to Predict Industry Change

Semiconductor Advanced Packaging

Nanotechnology and Nanoscience

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Principles of Nano-Optics

Heterogeneous Integrations

Nanotechnology For Dummies: Edition 2

Fan-Out Wafer-Level Packaging

Proceedings of 21st International Conference on Advanced Materials & Nanotechnology 2018: Journal of Material Sciences : Volume 6

3D IC Integration and Packaging

CMOS Processors and Memories

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Nanoscience Education, Workforce Training, and K-12 Resources

Artificial Intelligence in the Age of Nanotechnology

Assembly and Reliability of Lead-Free Solder Joints

Proceedings of 16th World Nano Conference 2017: Journal of Nanomaterials & Molecular Nanotechnology : Volume 6

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Technomimetics versus Biomimetics: An Application towards Artificial Intelligence