Fan-Out Wafer-Level Packaging

Heterogeneous Integrations

3D IC Integration and Packaging

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Semiconductor Advanced Packaging

Through-Silicon Vias for 3D Integration

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Assembly and Reliability of Lead-Free Solder Joints

Microvias: For Low Cost, High Density Interconnects

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

Advanced MEMS Packaging